Wafer Polishing Head Assembly
Multi-head polishing assembly that holds and rotates semiconductor wafers against polishing pads for mirror-finish surfaces. HTS 8473.50.9000 as equally suitable for various 8471 wafer processing machines. Achieves sub-micron surface roughness.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If configured as filter centrifuge parts
Similar rotating assemblies for other industrial separations classify in 8421.
If with integrated measuring sensors
Polishing heads with endpoint detection sensors classify as measuring instruments.
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Import Tips & Compliance
• Downforce/pressure specifications must be documented; kinematic mounting certification; watch pad contamination controls in shipping
Related Products under HTS 8473.50.90.00
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Wafer Lapping Plate
Cast iron or ceramic lapping plate used in wafer grinders/lappers to achieve ultra-flat surfaces on semiconductor wafers before fabrication. HTS 8473.50.9000 classification due to principal use with 8471 semiconductor processing machines. Critical for wafer planarity specifications.
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Semiconductor Wafer Chuck
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