Wafer Polishing Head Assembly from Germany
Multi-head polishing assembly that holds and rotates semiconductor wafers against polishing pads for mirror-finish surfaces. HTS 8473.50.9000 as equally suitable for various 8471 wafer processing machines. Achieves sub-micron surface roughness.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Downforce/pressure specifications must be documented; kinematic mounting certification; watch pad contamination controls in shipping