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8473.50.90.00/Wafer Polishing Head Assembly/Japan

Wafer Polishing Head Assembly from Japan

Multi-head polishing assembly that holds and rotates semiconductor wafers against polishing pads for mirror-finish surfaces. HTS 8473.50.9000 as equally suitable for various 8471 wafer processing machines. Achieves sub-micron surface roughness.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Downforce/pressure specifications must be documented; kinematic mounting certification; watch pad contamination controls in shipping

Wafer Polishing Head Assembly from Japan — Import Duty Rate | HTS 8473.50.90.00