Wafer Polishing Head Assembly from Canada
Multi-head polishing assembly that holds and rotates semiconductor wafers against polishing pads for mirror-finish surfaces. HTS 8473.50.9000 as equally suitable for various 8471 wafer processing machines. Achieves sub-micron surface roughness.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Downforce/pressure specifications must be documented; kinematic mounting certification; watch pad contamination controls in shipping