Wafer Polishing Head Assembly from Canada
Multi-head polishing assembly that holds and rotates semiconductor wafers against polishing pads for mirror-finish surfaces. HTS 8473.50.9000 as equally suitable for various 8471 wafer processing machines. Achieves sub-micron surface roughness.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Downforce/pressure specifications must be documented; kinematic mounting certification; watch pad contamination controls in shipping