Dicing Saw Laser Alignment Board
Printed circuit assembly processing laser alignment signals for wafer dicing saws cutting finished IC dice. HTS 8473.30.1180 for other PCAs of 8471 dicing machines without CRT. Ensures scribe lane precision.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general metal/wood cutting saw parts
Machine tool parts if not semiconductor dedicated.
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Import Tips & Compliance
• Kerf loss specs prove IC dicing use
• Coolant filtration compatibility
• Chipping minimization data
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