Dicing Saw Laser Alignment Board from Canada
Printed circuit assembly processing laser alignment signals for wafer dicing saws cutting finished IC dice. HTS 8473.30.1180 for other PCAs of 8471 dicing machines without CRT. Ensures scribe lane precision.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Kerf loss specs prove IC dicing use
• Coolant filtration compatibility
• Chipping minimization data