8473.30.11.80/Dicing Saw Laser Alignment Board/Canada

Dicing Saw Laser Alignment Board from Canada

Printed circuit assembly processing laser alignment signals for wafer dicing saws cutting finished IC dice. HTS 8473.30.1180 for other PCAs of 8471 dicing machines without CRT. Ensures scribe lane precision.

Duty Rate — Canada → United States

25%

Rate breakdown

9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Kerf loss specs prove IC dicing use

• Coolant filtration compatibility

• Chipping minimization data

Dicing Saw Laser Alignment Board from Canada — Import Duty Rate | HTS 8473.30.11.80