Other
Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472: > Parts and accessories of the machines of heading 8471: > Not incorporating a cathode ray tube: > Printed circuit assemblies > Other
Duty Rate (from China)
Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Products classified under HTS 8473.30.11.80
CMP Polisher Motor Driver Assembly
PCA driving stepper motors for slurry flow and pad conditioning in chemical mechanical planarization polishers for semiconductor wafers. Under HTS 8473.30.1180 as printed circuit parts for heading 8471 processing machines, CRT-free. Key for global planarization in IC fabrication.
Photoresist Spinner Drive Electronics
PCA controlling high-speed spin coating of photoresist on semiconductor wafers in lithography prep stations. Fits HTS 8473.30.1180 as dedicated printed circuit part for 8471 coating machines, no CRT. Achieves uniform thin-film deposition.
Etch Chamber Plasma Controller Board
Printed circuit assembly generating RF plasma for reactive ion etching of semiconductor wafers in plasma etch tools. HTS 8473.30.1180 for 8471 parts as other PCAs sans CRT. Enables anisotropic pattern transfer.
Wafer Inspection Stepper Interface PCA
PCA for stage motion control in step-and-repeat wafer inspection systems mapping defects pre-lithography. Under HTS 8473.30.1180 as printed circuit accessory for 8471 inspection machines, excluding CRTs. Sub-micron alignment critical.
Dicing Saw Laser Alignment Board
Printed circuit assembly processing laser alignment signals for wafer dicing saws cutting finished IC dice. HTS 8473.30.1180 for other PCAs of 8471 dicing machines without CRT. Ensures scribe lane precision.
Ion Implanter Beamline Control PCA
PCA regulating ion beam current, energy, and scan in ion implanters doping semiconductor wafers. Classified HTS 8473.30.1180 as part for 8471 implantation machines, no CRT. Dose uniformity <1% achieved.
Wafer Edge Grinder Vision PCA
Printed circuit board for machine vision processing edge profiles during semiconductor wafer edge grinding. HTS 8473.30.1180 for 8471 grinder accessories as other PCAs, CRT-free. Prevents chipping in handling.
Deposition Chamber Vacuum Controller
PCA monitoring turbopump speed and pressure in PVD/CVD chambers depositing thin films on semiconductor wafers. Under HTS 8473.30.1180 as printed circuit part principally for 8471 deposition machines, no CRT. Base pressure <10^-7 Torr.
Semiconductor Wafer Prober Test PCB
A printed circuit assembly designed specifically for control electronics in wafer probers used to test semiconductor devices during manufacturing. It falls under HTS 8473.30.1180 as a part suitable solely for machines of heading 8471, such as semiconductor testing equipment, without incorporating a cathode ray tube. This PCA handles signal processing and interfacing for precise wafer probing.
Crystal Grower Control Printed Circuit Board
Printed circuit assembly for regulating temperature and pull speed in Czochralski crystal growers used to produce monocrystalline silicon boules for semiconductor wafers. Classified under HTS 8473.30.1180 as a dedicated part for heading 8471 machines in semiconductor material growth. It interfaces sensors and actuators without CRT integration.
Wafer Grinder Servo Drive PCA
A printed circuit assembly providing servo control for precision grinding of semiconductor crystal boules to exact diameters in wafer preparation equipment. It qualifies for HTS 8473.30.1180 as a principal part of 8471 heading machines for semiconductor manufacturing, excluding CRTs. Critical for maintaining flatness and conductivity indicators.
Float Zone Furnace Power PCA
Printed circuit assembly managing high-current RF power delivery in float zone crystal pullers for ultra-pure semiconductor ingots. Falls under HTS 8473.30.1180 as a non-CRT part for 8471 semiconductor processing machines. Ensures stable zone melting for defect-free crystal growth.
Wafer Slicing Saw Controller Board
Specialized PCA for blade speed and coolant control in diamond saws that slice monocrystalline boules into semiconductor wafers. Classified in HTS 8473.30.1180 as other printed circuit assemblies for 8471 machines without CRTs. Vital for thin, damage-free wafer production.
Wafer Lapping Machine Interface PCA
Printed circuit board assembly interfacing pressure sensors and motors in lapping equipment that achieves flatness tolerances for semiconductor wafers pre-polishing. HTS 8473.30.1180 applies as a part principally for 8471 wafer preparation machines, no CRT. Ensures mirror-like surface preparation.
Semiconductor Handler Pick-and-Place PCA
Printed circuit assembly coordinating vacuum pick-and-place mechanisms in die handlers for semiconductor device assembly. HTS 8473.30.1180 for other PCAs of 8471 machines without CRTs. Handles precise die transfer from wafer to leadframe.