Dicing Saw Laser Alignment Board from Germany
Printed circuit assembly processing laser alignment signals for wafer dicing saws cutting finished IC dice. HTS 8473.30.1180 for other PCAs of 8471 dicing machines without CRT. Ensures scribe lane precision.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Kerf loss specs prove IC dicing use
• Coolant filtration compatibility
• Chipping minimization data