Wafer Edge Grinder
Wafer edge grinders chamfer and profile semiconductor wafer edges to prevent chipping during handling and processing. Part of wafer preparation equipment for heading 8470 machines, it falls under HTS 8473.29.00.00 due to its specialized semiconductor application.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for grinding edges of glass or ceramic discs
General grinding machines not semiconductor-specific.
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Import Tips & Compliance
• Provide edge profile drawings (e.g
• 45° chamfer specs)
• Certify compatibility with 200mm/300mm wafer standards
Related Products under HTS 8473.29.00.00
Wafer Cooling Station
Automated stations cool processed semiconductor wafers under controlled atmospheres to prevent thermal shock and contamination. Part of wafer preparation line for heading 8470, HTS 8473.29.00.00.
Float Zone Crystal Grower
Float zone crystal growers use a floating molten zone to purify and produce high-purity monocrystalline silicon ingots for semiconductor wafers. This equipment is a key accessory for machines in heading 8470, fitting HTS 8473.29.00.00 due to its principal use in semiconductor material processing.
Semiconductor Wafer Slicing Saw
Diamond wire or blade wafer slicing saws cut ultra-thin semiconductor wafers from monocrystalline boules with minimal material loss and damage. This essential wafer manufacturing apparatus is classified in HTS 8473.29.00.00 as an accessory for heading 8470 semiconductor processing machines.
Single Wafer Lapping Machine
Single wafer lapping machines use abrasive slurries to achieve sub-micron flatness on semiconductor wafers prior to polishing. This precision equipment is an accessory for semiconductor processing machines of heading 8470, classified in HTS 8473.29.00.00.
Silicon Ingot Annealing Furnace
Annealing furnaces heat-treat silicon ingots post-grinding to relieve stresses before wafer slicing. Specialized for semiconductor boule processing under heading 8470, it fits HTS 8473.29.00.00.
Wafer Thickness Measuring Gauge
Non-contact capacitive or laser gauges measure semiconductor wafer thickness to nanometer precision during processing. While often Chapter 90, integrated process control units for heading 8470 machines fall under HTS 8473.29.00.00.