Other
Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472: > Parts and accessories of the machines of heading 8470: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8473.29.00.00
Wafer Cooling Station
Automated stations cool processed semiconductor wafers under controlled atmospheres to prevent thermal shock and contamination. Part of wafer preparation line for heading 8470, HTS 8473.29.00.00.
Float Zone Crystal Grower
Float zone crystal growers use a floating molten zone to purify and produce high-purity monocrystalline silicon ingots for semiconductor wafers. This equipment is a key accessory for machines in heading 8470, fitting HTS 8473.29.00.00 due to its principal use in semiconductor material processing.
Semiconductor Wafer Slicing Saw
Diamond wire or blade wafer slicing saws cut ultra-thin semiconductor wafers from monocrystalline boules with minimal material loss and damage. This essential wafer manufacturing apparatus is classified in HTS 8473.29.00.00 as an accessory for heading 8470 semiconductor processing machines.
Single Wafer Lapping Machine
Single wafer lapping machines use abrasive slurries to achieve sub-micron flatness on semiconductor wafers prior to polishing. This precision equipment is an accessory for semiconductor processing machines of heading 8470, classified in HTS 8473.29.00.00.
Silicon Ingot Annealing Furnace
Annealing furnaces heat-treat silicon ingots post-grinding to relieve stresses before wafer slicing. Specialized for semiconductor boule processing under heading 8470, it fits HTS 8473.29.00.00.
Wafer Thickness Measuring Gauge
Non-contact capacitive or laser gauges measure semiconductor wafer thickness to nanometer precision during processing. While often Chapter 90, integrated process control units for heading 8470 machines fall under HTS 8473.29.00.00.
Boule Handling Robot Arm
Precision robotic arms transfer heavy crystal boules between processing stations in semiconductor crystal growth facilities. Designed principally for heading 8470 equipment, classified as parts under HTS 8473.29.00.00.
Diamond Wire Tensioner
Automatic tension control systems maintain precise wire tension in semiconductor wafer slicing saws. Essential accessory for heading 8470 slicing machines, under HTS 8473.29.00.00.
Czochralski Crystal Puller
A Czochralski crystal puller is a specialized machine used to grow monocrystalline silicon boules from molten semiconductor material by slowly pulling a seed crystal. It is classified under HTS 8473.29.00.00 as a part or accessory principally used with semiconductor manufacturing machines of heading 8470, specifically for wafer production.
Crystal Boule Grinder
Crystal boule grinders precisely shape semiconductor crystal ingots to exact diameters and grind orientation flats indicating conductivity and resistivity. As wafer preparation equipment, it qualifies under HTS 8473.29.00.00 for parts of heading 8470 machines used in semiconductor manufacturing.
Wafer Edge Grinder
Wafer edge grinders chamfer and profile semiconductor wafer edges to prevent chipping during handling and processing. Part of wafer preparation equipment for heading 8470 machines, it falls under HTS 8473.29.00.00 due to its specialized semiconductor application.
Chemical Mechanical Wafer Polisher
CMP (Chemical Mechanical Polishing) tools polish semiconductor wafers to atomic-level flatness using slurry and rotating pads. As critical wafer preparation apparatus for heading 8470 machines, classified under HTS 8473.29.00.00.