Wafer Edge Grinder from Japan
Wafer edge grinders chamfer and profile semiconductor wafer edges to prevent chipping during handling and processing. Part of wafer preparation equipment for heading 8470 machines, it falls under HTS 8473.29.00.00 due to its specialized semiconductor application.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide edge profile drawings (e.g
• 45° chamfer specs)
• Certify compatibility with 200mm/300mm wafer standards