Wafer Edge Grinder from Germany
Wafer edge grinders chamfer and profile semiconductor wafer edges to prevent chipping during handling and processing. Part of wafer preparation equipment for heading 8470 machines, it falls under HTS 8473.29.00.00 due to its specialized semiconductor application.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide edge profile drawings (e.g
• 45° chamfer specs)
• Certify compatibility with 200mm/300mm wafer standards