Semiconductor Wafer Lapping Jig

Multi-wafer carrier jig for simultaneous lapping of semiconductor wafers to achieve flatness tolerances critical for device fabrication. Used exclusively with lapping/polishing machines of heading 8460. HTS 8466.20.8040 as specialized work holder for semiconductor processing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China3.7%+35.0%38.7%
🇲🇽Mexico3.7%+10.0%13.7%
🇨🇦Canada3.7%+10.0%13.7%
🇩🇪Germany3.7%+10.0%13.7%
🇯🇵Japan3.7%+10.0%13.7%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

6804.10.00.00Lower: 35% vs 38.7%

If imported as millstones or grinding wheels

Lapping plates with bonded abrasives classify by material composition in Chapter 68.

8466.30.80Higher: 43% vs 38.7%

If basic dividing heads

Standard rotary work holders without semiconductor tolerances fall under simpler categories.

8419.19.01Lower: 35% vs 38.7%

If for laboratory polishing equipment

Small-scale lab jigs classify under laboratory machinery rather than industrial machine tools.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Specify total thickness variation (TTV) capabilities (<0.1 micron) to prove semiconductor specification

Include cleanroom class 1 certification for customs cleanroom equipment validation

Avoid importing with polishing slurries to prevent chemical classification complications