Semiconductor Wafer Lapping Jig from China
Multi-wafer carrier jig for simultaneous lapping of semiconductor wafers to achieve flatness tolerances critical for device fabrication. Used exclusively with lapping/polishing machines of heading 8460. HTS 8466.20.8040 as specialized work holder for semiconductor processing.
Duty Rate — China → United States
38.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify total thickness variation (TTV) capabilities (<0.1 micron) to prove semiconductor specification
• Include cleanroom class 1 certification for customs cleanroom equipment validation
• Avoid importing with polishing slurries to prevent chemical classification complications