Semiconductor Wafer Lapping Jig from Mexico
Multi-wafer carrier jig for simultaneous lapping of semiconductor wafers to achieve flatness tolerances critical for device fabrication. Used exclusively with lapping/polishing machines of heading 8460. HTS 8466.20.8040 as specialized work holder for semiconductor processing.
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify total thickness variation (TTV) capabilities (<0.1 micron) to prove semiconductor specification
• Include cleanroom class 1 certification for customs cleanroom equipment validation
• Avoid importing with polishing slurries to prevent chemical classification complications