Sapphire Wafer Back Grinder
Backside grinder for sapphire (Al2O3) substrates used in LED/GaN semiconductors, thinning wafers to device specs. HTS 8464.90.0120 as cold working glass-like mineral materials. Key for optoelectronics.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If cold working synthetic gem sapphire
Glass/sapphire working for non-semiconductor end use.
If integrated with LED epiwafer processing
Semiconductor manufacturing for compound devices.
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Import Tips & Compliance
• Prove sapphire semiconductor use vs. gem/watch applications
• Thickness control specs critical for classification
• Anti-dumping vigilance for Asian sapphire equipment
Related Products under HTS 8464.90.01.20
Czochralski Crystal Puller
A machine tool used to produce monocrystalline silicon boules by pulling a seed crystal from molten silicon in a vacuum chamber, grinding the boule to precise diameter for wafer production. Classified under HTS 8464.90.0120 as it functions as a grinder for semiconductor crystal ingots, akin to mineral material processing. Essential for semiconductor wafer manufacturing.
Gallium Arsenide Boule Grinder
Specialized grinder for GaAs compound semiconductor boules, achieving dimensional tolerances for wafer production. Classified in 8464.90.0120 as processing semiconductor materials like ceramics/minerals. Handles brittle III-V materials requiring diamond tooling.
Diamond Wafer Lapper
Lapping machine using diamond slurry to achieve flatness tolerances on semiconductor wafers before polishing. HTS 8464.90.0120 covers wafer grinders/lappers/polishers as mineral material working tools per notes. Prepares wafer surface for device fabrication.
SiC Wafer Grinder
Grinder for silicon carbide (SiC) power semiconductor wafers, handling extreme hardness of ceramic-like material. Fits HTS 8464.90.0120 as processing ceramics/minerals for semiconductor use. Enables high-voltage device production.
Silicon Ingot Grinder
Precision grinder that shapes semiconductor silicon ingots to exact diameters and flats indicating conductivity type, preparing them for wafer slicing. Falls under HTS 8464.90.0120 per statistical notes as crystal grinders for semiconductor materials treated like mineral processing tools. Critical step in wafer preparation.
Float Zone Crystal Grinder
Grinding machine for float zone method silicon boules, creating precise flats and diameters for resistivity indication before wafer slicing. HTS 8464.90.0120 applies as it processes semiconductor crystals like mineral materials per chapter notes. Used in high-purity semiconductor production.