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8464.90.01.20/Sapphire Wafer Back Grinder/Japan

Sapphire Wafer Back Grinder from Japan

Backside grinder for sapphire (Al2O3) substrates used in LED/GaN semiconductors, thinning wafers to device specs. HTS 8464.90.0120 as cold working glass-like mineral materials. Key for optoelectronics.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Prove sapphire semiconductor use vs. gem/watch applications

• Thickness control specs critical for classification

• Anti-dumping vigilance for Asian sapphire equipment

Sapphire Wafer Back Grinder from Japan — Import Duty Rate | HTS 8464.90.01.20