Sapphire Wafer Back Grinder from China
Backside grinder for sapphire (Al2O3) substrates used in LED/GaN semiconductors, thinning wafers to device specs. HTS 8464.90.0120 as cold working glass-like mineral materials. Key for optoelectronics.
Duty Rate — China → United States
39.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Prove sapphire semiconductor use vs. gem/watch applications
• Thickness control specs critical for classification
• Anti-dumping vigilance for Asian sapphire equipment