Semiconductor Glass Wafer Grinder

Precision grinder prepares quartz and borosilicate glass wafers for semiconductor masking and testing. HTS 8464.20.0110 includes glass working for high-tech applications per statistical notes context. Achieves sub-micron flatness.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China2%+35.0%37%
🇲🇽Mexico2%+10.0%12%
🇨🇦Canada2%+10.0%12%
🇩🇪Germany2%+10.0%12%
🇯🇵Japan2%+10.0%12%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8486.40.00Lower: 25% vs 37%

If silicon wafer processing version

Semiconductor statistical notes move silicon boules/wafers to dedicated provisions.

9013.80Lower: 14.5% vs 37%

If with laser metrology for wafer inspection

Optical/laser measuring integrated tools classify in Chapter 90.

8464.10.01.00Lower: 35% vs 37%

If optimized for crystalline semiconductor glass

Crystal boule grinders for semiconductor materials have specific breakout.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Reference statistical notes; provide semiconductor end-use declaration to avoid Chapter 90 testing equipment

Class 100 cleanroom compatibility docs required for validation

Dual-use export controls may apply – prepare ITAR/EAR statements

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