Semiconductor Glass Wafer Grinder from Germany
Precision grinder prepares quartz and borosilicate glass wafers for semiconductor masking and testing. HTS 8464.20.0110 includes glass working for high-tech applications per statistical notes context. Achieves sub-micron flatness.
Duty Rate — Germany → United States
12%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Reference statistical notes; provide semiconductor end-use declaration to avoid Chapter 90 testing equipment
• Class 100 cleanroom compatibility docs required for validation
• Dual-use export controls may apply – prepare ITAR/EAR statements