Semiconductor Glass Wafer Grinder from Germany
Precision grinder prepares quartz and borosilicate glass wafers for semiconductor masking and testing. HTS 8464.20.0110 includes glass working for high-tech applications per statistical notes context. Achieves sub-micron flatness.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Reference statistical notes; provide semiconductor end-use declaration to avoid Chapter 90 testing equipment
• Class 100 cleanroom compatibility docs required for validation
• Dual-use export controls may apply – prepare ITAR/EAR statements