Semiconductor Glass Wafer Grinder from Germany
Precision grinder prepares quartz and borosilicate glass wafers for semiconductor masking and testing. HTS 8464.20.0110 includes glass working for high-tech applications per statistical notes context. Achieves sub-micron flatness.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Reference statistical notes; provide semiconductor end-use declaration to avoid Chapter 90 testing equipment
• Class 100 cleanroom compatibility docs required for validation
• Dual-use export controls may apply – prepare ITAR/EAR statements