8464.20.01.10/Semiconductor Glass Wafer Grinder/Japan

Semiconductor Glass Wafer Grinder from Japan

Precision grinder prepares quartz and borosilicate glass wafers for semiconductor masking and testing. HTS 8464.20.0110 includes glass working for high-tech applications per statistical notes context. Achieves sub-micron flatness.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Reference statistical notes; provide semiconductor end-use declaration to avoid Chapter 90 testing equipment

• Class 100 cleanroom compatibility docs required for validation

• Dual-use export controls may apply – prepare ITAR/EAR statements