Semiconductor Glass Wafer Grinder from China
Precision grinder prepares quartz and borosilicate glass wafers for semiconductor masking and testing. HTS 8464.20.0110 includes glass working for high-tech applications per statistical notes context. Achieves sub-micron flatness.
Duty Rate — China → United States
39.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Reference statistical notes; provide semiconductor end-use declaration to avoid Chapter 90 testing equipment
• Class 100 cleanroom compatibility docs required for validation
• Dual-use export controls may apply – prepare ITAR/EAR statements