Used Wafer Edge Grinder
Rebuilt grinder for profiling wafer edges post-slicing to prevent chipping during handling. Classifies in HTS 8463.90.0040 as used tool for cermet working without removal, for semiconductor wafer prep. Achieves mirror-finish edges.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If performing abrasive edge finishing
Grinding wheels and edge grinders with material removal are in Chapter 8460.
If part of wafer preparation line
Falls under semiconductor wafer prep equipment in statistical note to 8486.
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Import Tips & Compliance
• Document edge profiling specs (bevel angles, surface finish)
• Ensure vacuum chuck compatibility declaration for handling
• Watch for reclassification if marketed as semiconductor-specific
Related Products under HTS 8463.90.00.40
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Used Czochralski Crystal Puller
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Rebuilt Float Zone Crystal Grower
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Used Crystal Boule Grinder
Rebuilt grinder for shaping silicon crystal boules to precise diameters and flats indicating conductivity type. Under HTS 8463.90.0040 for used machine tools working cermets or metal without removal, used in wafer preparation. Ensures boule readiness for slicing.