Used Wafer Edge Grinder from Canada
Rebuilt grinder for profiling wafer edges post-slicing to prevent chipping during handling. Classifies in HTS 8463.90.0040 as used tool for cermet working without removal, for semiconductor wafer prep. Achieves mirror-finish edges.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document edge profiling specs (bevel angles, surface finish)
• Ensure vacuum chuck compatibility declaration for handling
• Watch for reclassification if marketed as semiconductor-specific