Used Wafer Edge Grinder from Canada
Rebuilt grinder for profiling wafer edges post-slicing to prevent chipping during handling. Classifies in HTS 8463.90.0040 as used tool for cermet working without removal, for semiconductor wafer prep. Achieves mirror-finish edges.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document edge profiling specs (bevel angles, surface finish)
• Ensure vacuum chuck compatibility declaration for handling
• Watch for reclassification if marketed as semiconductor-specific