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8463.90.00.40/Used Wafer Edge Grinder/Japan

Used Wafer Edge Grinder from Japan

Rebuilt grinder for profiling wafer edges post-slicing to prevent chipping during handling. Classifies in HTS 8463.90.0040 as used tool for cermet working without removal, for semiconductor wafer prep. Achieves mirror-finish edges.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document edge profiling specs (bevel angles, surface finish)

• Ensure vacuum chuck compatibility declaration for handling

• Watch for reclassification if marketed as semiconductor-specific

Used Wafer Edge Grinder from Japan — Import Duty Rate | HTS 8463.90.00.40