Ultra-Precision Wafer Prep Slotter UPS-1000
Nanometer-precision slotter for creating reference flats on semiconductor wafers post-slicing, critical for photolithography alignment. Though post-slicing, maintains HTS 8461.20 classification for precision shaping in semiconductor fabrication.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If post-slicing wafer processing equipment
Statistical notes cover complete semiconductor device processing beyond boule prep
If primarily for wafer pattern alignment
Photolithography alignment equipment classified under optical processing machines
If general wafer saw sharpening
Wafer saw blade sharpening equipment falls under grinding/sharpening provisions
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Import Tips & Compliance
• Include flatness specification data (angstroms); verify cleanroom particulate ratings; distinguish from post-fab edge profiling equipment
Related Products under HTS 8461.20.80.90
CNC Slotting Machine for Semiconductor Wafer Flats
This precision CNC slotting machine grinds flats on monocrystalline semiconductor boules to indicate conductivity type and resistivity, as defined in statistical notes for wafer preparation equipment. It removes material from crystal boules to precise specifications required for semiconductor wafer production. Classified under 8461.20.80.90 as a slotting machine for shaping semiconductor materials by metal/cermet removal.
Precision Crystal Boule Slotter Model CZ-200
Automated slotting machine employing Czochralski boule processing to cut orientation flats on silicon ingots for wafer slicing alignment. Removes cermet material to exact resistivity-indicating flat positions per HTS statistical notes. Falls under 8461.20.80.90 as specialized slotting equipment for semiconductor crystal preparation.
Gallium Arsenide Wafer Slotting Grinder GS-450
High-precision slotting grinder for creating flats on GaAs compound semiconductor boules, essential for wafer alignment in optoelectronic device fabrication. Material removal via diamond tooling on cermet composites meets HTS 8461.20 shaping criteria for semiconductor processing equipment.
Automated Semiconductor Flat Slotting Station FSS-3000
Robotic slotting system for simultaneous multi-flat machining on silicon boules, maintaining crystal orientation for automated wafer sawing lines. Precision shaping by controlled material removal qualifies as HTS 8461.20.80.90 slotting machine per statistical definitions.
Float Zone Silicon Ingot Slotter FZ-Precision 12
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Diamond Tip Crystal Flat Broacher DB-150
Broaching machine using diamond tools to cut precise flats on semiconductor boules, ensuring accurate wafer slicing orientation. Though HTS notes emphasize grinding, broaching material removal qualifies under 8461.20 shaping/slotting for semiconductor prep.