Ultra-Precision Wafer Prep Slotter UPS-1000 from Japan
Nanometer-precision slotter for creating reference flats on semiconductor wafers post-slicing, critical for photolithography alignment. Though post-slicing, maintains HTS 8461.20 classification for precision shaping in semiconductor fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include flatness specification data (angstroms); verify cleanroom particulate ratings; distinguish from post-fab edge profiling equipment