Other
Machine tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine tools working by removing metal or cermets, not elsewhere specified or included: > Shaping or slotting machines: > Other > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8461.20.80.90
CNC Slotting Machine for Semiconductor Wafer Flats
This precision CNC slotting machine grinds flats on monocrystalline semiconductor boules to indicate conductivity type and resistivity, as defined in statistical notes for wafer preparation equipment. It removes material from crystal boules to precise specifications required for semiconductor wafer production. Classified under 8461.20.80.90 as a slotting machine for shaping semiconductor materials by metal/cermet removal.
Precision Crystal Boule Slotter Model CZ-200
Automated slotting machine employing Czochralski boule processing to cut orientation flats on silicon ingots for wafer slicing alignment. Removes cermet material to exact resistivity-indicating flat positions per HTS statistical notes. Falls under 8461.20.80.90 as specialized slotting equipment for semiconductor crystal preparation.
Gallium Arsenide Wafer Slotting Grinder GS-450
High-precision slotting grinder for creating flats on GaAs compound semiconductor boules, essential for wafer alignment in optoelectronic device fabrication. Material removal via diamond tooling on cermet composites meets HTS 8461.20 shaping criteria for semiconductor processing equipment.
Automated Semiconductor Flat Slotting Station FSS-3000
Robotic slotting system for simultaneous multi-flat machining on silicon boules, maintaining crystal orientation for automated wafer sawing lines. Precision shaping by controlled material removal qualifies as HTS 8461.20.80.90 slotting machine per statistical definitions.
Float Zone Silicon Ingot Slotter FZ-Precision 12
Specialized slotter for float zone method silicon ingots, creating precise resistivity flats for high-purity power semiconductor wafers. Cermet removal shaping aligns with HTS statistical notes for wafer preparation grinders/slotters.
Diamond Tip Crystal Flat Broacher DB-150
Broaching machine using diamond tools to cut precise flats on semiconductor boules, ensuring accurate wafer slicing orientation. Though HTS notes emphasize grinding, broaching material removal qualifies under 8461.20 shaping/slotting for semiconductor prep.
Multi-Axis Semiconductor Slotting Center MSC-800
5-axis CNC slotting center programmed for complex flat geometries on various semiconductor materials including SiC and sapphire boules. Advanced shaping capability for next-generation semiconductor wafer preparation per HTS definitions.
Semiconductor Crystal Grinder-Slotter Combo CGS-500
Dual-function machine combining grinding and slotting operations for semiconductor boule preparation, streamlining wafer flat creation and diameter control. Statistical notes recognize both grinding flats and diameter as essential wafer prep processes.
Ultra-Precision Wafer Prep Slotter UPS-1000
Nanometer-precision slotter for creating reference flats on semiconductor wafers post-slicing, critical for photolithography alignment. Though post-slicing, maintains HTS 8461.20 classification for precision shaping in semiconductor fabrication.
Sapphire Boule Orientation Slotter SBS-300
Slotting machine for synthetic sapphire boules used in LED/compound semiconductor substrates, creating crystal orientation flats for precise wafer slicing. Material removal shaping for semiconductor optical substrates qualifies under HTS 8461.20.80.90.
SiC Boule Flat Cutting Machine SFCM-600
Precision slotting/cutting machine for silicon carbide boules used in power electronics, creating flats indicating polytype and doping concentration. High-hardness cermet removal for wide bandgap semiconductor prep per HTS definitions.
Crystal Resistivity Flat Slotter RFS-250
Dedicated slotter positioning flats according to crystal resistivity mapping for semiconductor dopant profiling. Essential equipment linking boule growth parameters to wafer specifications per HTS statistical notes.
High-Throughput Wafer Prep Slotting Line HTS-1200
Production-scale slotting line processing 12-inch semiconductor boules for high-volume logic/memory wafer fabrication. Automated flat creation maintains throughput for modern semiconductor manufacturing facilities.
Custom Semiconductor Slotting Workcenter CSW-900
Modular slotting workcenter configurable for various semiconductor materials and flat geometries, used by R&D fabs for prototype boule processing. Flexible shaping platform for next-generation semiconductor development.
Advanced Crystal Flat Profiler ACFP-400
Profiling slotter creating tapered flats and complex orientations for advanced semiconductor architectures including 3D NAND and FinFET wafers. Next-generation flat geometry shaping for leading-edge semiconductor processing.