Ultra-Precision Wafer Prep Slotter UPS-1000 from Germany
Nanometer-precision slotter for creating reference flats on semiconductor wafers post-slicing, critical for photolithography alignment. Though post-slicing, maintains HTS 8461.20 classification for precision shaping in semiconductor fabrication.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include flatness specification data (angstroms); verify cleanroom particulate ratings; distinguish from post-fab edge profiling equipment