CNC Precision Lapping Machine for Semiconductor Wafers
This machine uses abrasive slurries to lap semiconductor wafers to exact flatness tolerances required for fabrication processes. Classified under HTS 8460.40.80.80 as a lapping machine for finishing metal (silicon wafers) with polishing products, distinct from testing apparatus in Chapter 90. It prepares wafer surfaces for photolithography by removing microscopic imperfections.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If primarily for inline wafer testing rather than surface preparation
Equipment focused on electrical/optical testing of semiconductor devices falls under Chapter 90 draw-back provisions.
If sold as component parts for assembly into lapping machines
Unfinished parts or accessories for semiconductor machines classified separately from complete functioning machines.
If for general metal workpiece lapping, not semiconductor-specific
Non-semiconductor finishing machines fall under broader 'other' grinding/lapping categories.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Verify machine specifications confirm lapping function for metal/semiconductor surfaces to avoid reclassification as Chapter 90 testing equipment
• Include detailed technical datasheets showing abrasive slurry use and surface finishing tolerances in import documentation
Related Products under HTS 8460.40.80.80
Automated Wafer Honing System Model WH-3000
Precision honing machine that uses superabrasive tools to finish wafer edge profiles and chamfers, preventing micro-cracks during handling. HTS 8460.40.80.80 classification for honing machines finishing semiconductor metal surfaces other than gears. Essential for yield improvement in 300mm wafer fabs.
Double-Sided Lapper for Silicon Wafer Processing
Industrial lapping machine that simultaneously polishes both sides of silicon wafers using diamond abrasives to achieve nanometer-level flatness. Falls under HTS 8460.40.80.80 as specialized lapping equipment for semiconductor metal finishing, per statistical notes on wafer preparation equipment. Critical for maintaining wafer parallelism in IC production.
Chemical Mechanical Planarization (CMP) Lapping Platform
CMP equipment using polishing pads and chemical slurries to planarize wafer surfaces during semiconductor fabrication. Though CMP-specific, classified under HTS 8460.40.80.80 as lapping/polishing machines for metal (silicon) finishing per statistical notes. Removes material layer-by-layer for multilayer chip construction.
High-Speed Wafer Polisher with In-Situ Cleaning
Rotary polishing machine for final mirror finish on semiconductor wafers, incorporating brush cleaning stations. HTS 8460.40.80.80 for polishing machines finishing cermet/semiconductor surfaces using polishing products. Achieves surface roughness <0.5nm for advanced nodes.