CNC Precision Lapping Machine for Semiconductor Wafers from Japan
This machine uses abrasive slurries to lap semiconductor wafers to exact flatness tolerances required for fabrication processes. Classified under HTS 8460.40.80.80 as a lapping machine for finishing metal (silicon wafers) with polishing products, distinct from testing apparatus in Chapter 90. It prepares wafer surfaces for photolithography by removing microscopic imperfections.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify machine specifications confirm lapping function for metal/semiconductor surfaces to avoid reclassification as Chapter 90 testing equipment
• Include detailed technical datasheets showing abrasive slurry use and surface finishing tolerances in import documentation