CNC Precision Lapping Machine for Semiconductor Wafers from Germany
This machine uses abrasive slurries to lap semiconductor wafers to exact flatness tolerances required for fabrication processes. Classified under HTS 8460.40.80.80 as a lapping machine for finishing metal (silicon wafers) with polishing products, distinct from testing apparatus in Chapter 90. It prepares wafer surfaces for photolithography by removing microscopic imperfections.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Verify machine specifications confirm lapping function for metal/semiconductor surfaces to avoid reclassification as Chapter 90 testing equipment
• Include detailed technical datasheets showing abrasive slurry use and surface finishing tolerances in import documentation