Double-Sided Lapper for Silicon Wafer Processing
Industrial lapping machine that simultaneously polishes both sides of silicon wafers using diamond abrasives to achieve nanometer-level flatness. Falls under HTS 8460.40.80.80 as specialized lapping equipment for semiconductor metal finishing, per statistical notes on wafer preparation equipment. Critical for maintaining wafer parallelism in IC production.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If configured for optical lens or general precision component lapping
Lapping machines for non-metal or non-semiconductor surfaces classified under other finishing categories.
If classified as semiconductor manufacturing machines when wafer-specific features dominate
Statistical notes direct certain wafer prep equipment to Chapter 84 semiconductor provisions.
If equipped with integrated metrology for surface profiling
Machines combining finishing with precision measuring functions move to Chapter 90.
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Import Tips & Compliance
• Document wafer thickness tolerance specifications (<1μm) to justify semiconductor classification over general metalworking
• Ensure carrier plate materials and slurry compositions are listed for customs validation of lapping function
Related Products under HTS 8460.40.80.80
Automated Wafer Honing System Model WH-3000
Precision honing machine that uses superabrasive tools to finish wafer edge profiles and chamfers, preventing micro-cracks during handling. HTS 8460.40.80.80 classification for honing machines finishing semiconductor metal surfaces other than gears. Essential for yield improvement in 300mm wafer fabs.
CNC Precision Lapping Machine for Semiconductor Wafers
This machine uses abrasive slurries to lap semiconductor wafers to exact flatness tolerances required for fabrication processes. Classified under HTS 8460.40.80.80 as a lapping machine for finishing metal (silicon wafers) with polishing products, distinct from testing apparatus in Chapter 90. It prepares wafer surfaces for photolithography by removing microscopic imperfections.
Chemical Mechanical Planarization (CMP) Lapping Platform
CMP equipment using polishing pads and chemical slurries to planarize wafer surfaces during semiconductor fabrication. Though CMP-specific, classified under HTS 8460.40.80.80 as lapping/polishing machines for metal (silicon) finishing per statistical notes. Removes material layer-by-layer for multilayer chip construction.
High-Speed Wafer Polisher with In-Situ Cleaning
Rotary polishing machine for final mirror finish on semiconductor wafers, incorporating brush cleaning stations. HTS 8460.40.80.80 for polishing machines finishing cermet/semiconductor surfaces using polishing products. Achieves surface roughness <0.5nm for advanced nodes.