Double-Sided Lapper for Silicon Wafer Processing from Japan
Industrial lapping machine that simultaneously polishes both sides of silicon wafers using diamond abrasives to achieve nanometer-level flatness. Falls under HTS 8460.40.80.80 as specialized lapping equipment for semiconductor metal finishing, per statistical notes on wafer preparation equipment. Critical for maintaining wafer parallelism in IC production.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document wafer thickness tolerance specifications (<1μm) to justify semiconductor classification over general metalworking
• Ensure carrier plate materials and slurry compositions are listed for customs validation of lapping function