Used Peter Wolters AC 380 Lapping-Polishing System
A used double-sided lapping and polishing machine for simultaneous finishing of semiconductor wafer surfaces with colloidal abrasives. HTS 8460.40.8010 applies to this used lapping machine for achieving mirror finishes on metal or cermet substrates in electronics manufacturing. Critical for minimizing total thickness variation (TTV) in wafer production.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If when equipped with integrated optical profilometers
Lapping machines with built-in wafer measurement capabilities classify as testing apparatus in Chapter 90.
If for semiconductor-specific wafer processing lines
Compilation statistical notes may capture complete wafer prep machines under other semiconductor provisions.
If imported with semiconductor-specific accessories as a set
Machines sold complete with wafer handling chucks classify under accessories for semiconductor equipment.
Not sure which classification is right?
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Import Tips & Compliance
• Document operating hours and rebuild date; over 1,000 hours usage typically qualifies as 'used' per CBP guidelines
• Include slurry compatibility specs; environmental docs needed for abrasive waste handling
• Avoid pitfall of classifying with accessories as a set, which could shift to other headings
Related Products under HTS 8460.40.80.10
Used Okamoto ACC-322DX Lapping Machine
A rebuilt horizontal lapping machine designed for finishing flat semiconductor wafers to precise tolerances using abrasive slurries. It falls under HTS 8460.40.8010 as a used or rebuilt lapping machine for metal or cermets, specifically applied in wafer preparation for semiconductor fabrication. The machine ensures wafer flatness critical for subsequent processing steps.
Rebuilt Disco DFG8360 Wafer Grinder
A refurbished double-disk grinder for back-grinding semiconductor wafers to ultra-thin specifications using diamond abrasives. Classified under HTS 8460.40.8010 as a rebuilt grinding machine for cermet-like wafer materials in semiconductor processing. It prepares wafers for packaging by reducing thickness while maintaining flatness.
Rebuilt Engis Hyprez Lapping Machine
Rebuilt precision lapping system for finishing semiconductor substrates including silicon carbide wafers using electrolytic abrasives. Under HTS 8460.40.8010 as rebuilt lapping machine for hard cermet materials. Achieves damage-free surfaces for power semiconductor applications.
Used Moore Machine Tool Nanometer Lapper
Used advanced lapping machine achieving nanometer-level wafer flatness for leading-edge semiconductor production. HTS 8460.40.8010 classification for used lapping of precision metal/cermet parts. Features active thermal control for consistent polishing results.
Reconditioned Lapmaster 48 Wolters Lapper
Reconditioned flat lapping machine optimized for silicon wafer surface finishing using diamond or alumina slurries. Falls under HTS 8460.40.8010 as rebuilt lapping equipment for cermet semiconductor materials. Delivers sub-micron flatness required for photolithography processes.
Used Strasbaugh 7AA Wafer Polisher
Used chemical-mechanical planarization (CMP) polisher for semiconductor wafers, though mechanically classified as lapping/polishing via abrasives. HTS 8460.40.8010 for used machines finishing cermet wafers. Provides global planarization essential for multi-layer device fabrication.