Rebuilt Disco DFG8360 Wafer Grinder
A refurbished double-disk grinder for back-grinding semiconductor wafers to ultra-thin specifications using diamond abrasives. Classified under HTS 8460.40.8010 as a rebuilt grinding machine for cermet-like wafer materials in semiconductor processing. It prepares wafers for packaging by reducing thickness while maintaining flatness.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If dedicated to semiconductor wafer manufacturing processes
Statistical provisions cover wafer preparation grinders under semiconductor machines rather than general finishing tools.
If condition assessment deems it 'new' rather than rebuilt
Like-new refurbished machines without clear usage history default to new equipment subheading.
If imported as replacement grinding components only
Individual grinding wheels or laps separate from the full machine classify as tools, not complete machines.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Provide rebuild invoices and test reports post-refurbishment; US Customs requires proof it's not 'new' to qualify for used rates
• Declare precise wafer thickness capabilities in entry docs; mismatch leads to reclassification
• Check for dual-use export licensing if grinder supports advanced node semiconductors
Related Products under HTS 8460.40.80.10
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A rebuilt horizontal lapping machine designed for finishing flat semiconductor wafers to precise tolerances using abrasive slurries. It falls under HTS 8460.40.8010 as a used or rebuilt lapping machine for metal or cermets, specifically applied in wafer preparation for semiconductor fabrication. The machine ensures wafer flatness critical for subsequent processing steps.
Used Peter Wolters AC 380 Lapping-Polishing System
A used double-sided lapping and polishing machine for simultaneous finishing of semiconductor wafer surfaces with colloidal abrasives. HTS 8460.40.8010 applies to this used lapping machine for achieving mirror finishes on metal or cermet substrates in electronics manufacturing. Critical for minimizing total thickness variation (TTV) in wafer production.
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