Rebuilt Disco DFG8360 Wafer Grinder from China
A refurbished double-disk grinder for back-grinding semiconductor wafers to ultra-thin specifications using diamond abrasives. Classified under HTS 8460.40.8010 as a rebuilt grinding machine for cermet-like wafer materials in semiconductor processing. It prepares wafers for packaging by reducing thickness while maintaining flatness.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide rebuild invoices and test reports post-refurbishment; US Customs requires proof it's not 'new' to qualify for used rates
• Declare precise wafer thickness capabilities in entry docs; mismatch leads to reclassification
• Check for dual-use export licensing if grinder supports advanced node semiconductors