Rebuilt Disco DFG8360 Wafer Grinder from Japan
A refurbished double-disk grinder for back-grinding semiconductor wafers to ultra-thin specifications using diamond abrasives. Classified under HTS 8460.40.8010 as a rebuilt grinding machine for cermet-like wafer materials in semiconductor processing. It prepares wafers for packaging by reducing thickness while maintaining flatness.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide rebuild invoices and test reports post-refurbishment; US Customs requires proof it's not 'new' to qualify for used rates
• Declare precise wafer thickness capabilities in entry docs; mismatch leads to reclassification
• Check for dual-use export licensing if grinder supports advanced node semiconductors