Used Peter Wolters AC 380 Lapping-Polishing System from Japan
A used double-sided lapping and polishing machine for simultaneous finishing of semiconductor wafer surfaces with colloidal abrasives. HTS 8460.40.8010 applies to this used lapping machine for achieving mirror finishes on metal or cermet substrates in electronics manufacturing. Critical for minimizing total thickness variation (TTV) in wafer production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document operating hours and rebuild date; over 1,000 hours usage typically qualifies as 'used' per CBP guidelines
• Include slurry compatibility specs; environmental docs needed for abrasive waste handling
• Avoid pitfall of classifying with accessories as a set, which could shift to other headings