Crystal Boule Grinder
Machine specifically for grinding semiconductor crystal boules (e.g., silicon) to exact diameters and flats per statistical notes for wafer preparation. Falls under HTS 8460.29.0110 as external cylindrical grinder using abrasives on semiconductor metal-like materials or cermets. Critical for Czochralski method crystals.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for semiconductor wafer slicing prep only
Machines for semiconductor material processing may classify under 8486 per Chapter 84 notes.
If primarily for polishing
Polishing-focused machines use different abrasives, under 'other' non-specific subheading.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Reference statistical note (a)(ii)(A) in entry summary; provide boule grinding demo evidence
• Duty may be reduced for dedicated semiconductor use – apply for binding ruling if borderline
• Avoid pitfall of classifying as polishing (8460.29.0190) by stressing diameter grinding function
Related Products under HTS 8460.29.01.10
Automotive Crankshaft Grinder
Machine for grinding external journals on automotive crankshafts, a metal cylindrical part. Classified in HTS 8460.29.0110 for external cylindrical grinding operations. Precision finishing with abrasives.
Hydraulic Universal Grinder
Hydraulically controlled universal grinder for external cylindrical metal parts. HTS 8460.29.0110 due to universal external capability.
Cermet Finishing Grinder
Grinder for cermet (ceramic-metal) cylindrical parts using abrasives. Explicitly under HTS 8460.29.0110 for cermets.
Silicon Ingot Diameter Grinder
For grinding silicon ingot diameters pre-slicing, per statistical notes.
High-Speed External Cylindrical Grinder
High RPM grinder for small precise external cylinders.
CNC External Cylindrical Grinder
A computer numerically controlled machine designed for precision grinding of external cylindrical surfaces on metal workpieces, such as shafts and rollers. It falls under HTS 8460.29.0110 as an external cylindrical grinding machine used in semiconductor wafer preparation equipment for grinding crystal boules to precise diameters. The machine employs grinding wheels to achieve high tolerances required for monocrystalline semiconductor materials.