Crystal Boule Grinder from Germany
Machine specifically for grinding semiconductor crystal boules (e.g., silicon) to exact diameters and flats per statistical notes for wafer preparation. Falls under HTS 8460.29.0110 as external cylindrical grinder using abrasives on semiconductor metal-like materials or cermets. Critical for Czochralski method crystals.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Reference statistical note (a)(ii)(A) in entry summary; provide boule grinding demo evidence
• Duty may be reduced for dedicated semiconductor use – apply for binding ruling if borderline
• Avoid pitfall of classifying as polishing (8460.29.0190) by stressing diameter grinding function