CNC External Cylindrical Grinder
A computer numerically controlled machine designed for precision grinding of external cylindrical surfaces on metal workpieces, such as shafts and rollers. It falls under HTS 8460.29.0110 as an external cylindrical grinding machine used in semiconductor wafer preparation equipment for grinding crystal boules to precise diameters. The machine employs grinding wheels to achieve high tolerances required for monocrystalline semiconductor materials.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for internal cylindrical surfaces
Internal cylindrical grinding machines are classified separately under the 'internal' subheading, not external.
If designed for honing rather than grinding
Honing machines use abrasive stones for finishing bores, falling under the honing subheading instead of grinding.
If classified as semiconductor-specific wafer processing machine
Statistical notes may shift certain wafer boule grinders to Chapter 84 provisions for semiconductor manufacturing equipment.
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Import Tips & Compliance
• Verify machine specifications match 'external cylindrical' classification; include technical datasheets showing grinding wheel usage on metal
• Obtain end-user certificates if destined for semiconductor manufacturing to qualify for potential duty exemptions under statistical notes
• Ensure CE marking or equivalent for safety compliance; common pitfall is misclassifying as universal if not explicitly external-focused
Related Products under HTS 8460.29.01.10
Automotive Crankshaft Grinder
Machine for grinding external journals on automotive crankshafts, a metal cylindrical part. Classified in HTS 8460.29.0110 for external cylindrical grinding operations. Precision finishing with abrasives.
Hydraulic Universal Grinder
Hydraulically controlled universal grinder for external cylindrical metal parts. HTS 8460.29.0110 due to universal external capability.
Cermet Finishing Grinder
Grinder for cermet (ceramic-metal) cylindrical parts using abrasives. Explicitly under HTS 8460.29.0110 for cermets.
Silicon Ingot Diameter Grinder
For grinding silicon ingot diameters pre-slicing, per statistical notes.
High-Speed External Cylindrical Grinder
High RPM grinder for small precise external cylinders.
Precision Shaft External Grinder
Specialized grinder for external surfaces of precision metal shafts used in machinery, including those for semiconductor equipment. It qualifies under HTS 8460.29.0110 for external cylindrical grinding with abrasives on metal. Achieves micron-level tolerances essential for boule grinders in wafer manufacturing.