CNC External Cylindrical Grinder

A computer numerically controlled machine designed for precision grinding of external cylindrical surfaces on metal workpieces, such as shafts and rollers. It falls under HTS 8460.29.0110 as an external cylindrical grinding machine used in semiconductor wafer preparation equipment for grinding crystal boules to precise diameters. The machine employs grinding wheels to achieve high tolerances required for monocrystalline semiconductor materials.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+35.0%39.4%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪Germany4.4%+10.0%14.4%
🇯🇵Japan4.4%+10.0%14.4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.39.00Same rate: 39.4%

If for internal cylindrical surfaces

Internal cylindrical grinding machines are classified separately under the 'internal' subheading, not external.

8460.40Lower: 14.4% vs 39.4%

If designed for honing rather than grinding

Honing machines use abrasive stones for finishing bores, falling under the honing subheading instead of grinding.

8479.89.65.00Lower: 20.3% vs 39.4%

If classified as semiconductor-specific wafer processing machine

Statistical notes may shift certain wafer boule grinders to Chapter 84 provisions for semiconductor manufacturing equipment.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Verify machine specifications match 'external cylindrical' classification; include technical datasheets showing grinding wheel usage on metal

Obtain end-user certificates if destined for semiconductor manufacturing to qualify for potential duty exemptions under statistical notes

Ensure CE marking or equivalent for safety compliance; common pitfall is misclassifying as universal if not explicitly external-focused