CNC External Cylindrical Grinder from Japan
A computer numerically controlled machine designed for precision grinding of external cylindrical surfaces on metal workpieces, such as shafts and rollers. It falls under HTS 8460.29.0110 as an external cylindrical grinding machine used in semiconductor wafer preparation equipment for grinding crystal boules to precise diameters. The machine employs grinding wheels to achieve high tolerances required for monocrystalline semiconductor materials.
Duty Rate — Japan → United States
Rate breakdown
Import Tips
• Verify machine specifications match 'external cylindrical' classification; include technical datasheets showing grinding wheel usage on metal
• Obtain end-user certificates if destined for semiconductor manufacturing to qualify for potential duty exemptions under statistical notes
• Ensure CE marking or equivalent for safety compliance; common pitfall is misclassifying as universal if not explicitly external-focused