Crystal Boule Grinder from China
Machine specifically for grinding semiconductor crystal boules (e.g., silicon) to exact diameters and flats per statistical notes for wafer preparation. Falls under HTS 8460.29.0110 as external cylindrical grinder using abrasives on semiconductor metal-like materials or cermets. Critical for Czochralski method crystals.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Reference statistical note (a)(ii)(A) in entry summary; provide boule grinding demo evidence
• Duty may be reduced for dedicated semiconductor use – apply for binding ruling if borderline
• Avoid pitfall of classifying as polishing (8460.29.0190) by stressing diameter grinding function