Reconditioned Doosan Puma Boring and Tapping Center
Numerically controlled rebuilt machine tool combining boring, milling, and tapping for metal removal in wafer slicing preparation equipment. Classified in HTS 8459.41.0010 as used/rebuilt boring machine with semiconductor grinding applications.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.2% | +35.0% | 39.2% |
| 🇲🇽Mexico | 4.2% | +10.0% | 14.2% |
| 🇨🇦Canada | 4.2% | +10.0% | 14.2% |
| 🇩🇪Germany | 4.2% | +10.0% | 14.2% |
| 🇯🇵Japan | 4.2% | +10.0% | 14.2% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If includes tool changer as primary feature over boring
Machines with integrated tool changing for numeric control may classify under work/tool positioning headings.
If adapted for testing semiconductor wafers post-machining
Per statistical notes, testing equipment shifts to Chapter 90 even if originally metal removal tools.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Ensure tapping function documentation emphasizes metal removal to distinguish from threading machines in 8458
• Use ISF filing 24+ hours prior for heavy machinery to avoid delays at semiconductor fab import sites
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