Used Haas VF-2 Vertical Machining Center
A rebuilt numerically controlled vertical machining center with 3-axis milling capabilities, refurbished for precision boring and milling operations by removing metal. Classified under HTS 8459.41.0010 as it is used/rebuilt equipment specifically for boring-milling functions in metalworking. Falls within the statistical notes for semiconductor wafer processing equipment like grinders and polishers due to its application in wafer preparation.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.2% | +35.0% | 39.2% |
| 🇲🇽Mexico | 4.2% | +10.0% | 14.2% |
| 🇨🇦Canada | 4.2% | +10.0% | 14.2% |
| 🇩🇪Germany | 4.2% | +10.0% | 14.2% |
| 🇯🇵Japan | 4.2% | +10.0% | 14.2% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If primarily for flexible manufacturing systems in semiconductor production
Machines with numerical control not dedicated to single boring/milling may shift to Chapter 84 heading for assembly machine-tools.
If imported as parts or accessories rather than complete rebuilt machine
Disassembled or component-focused imports for boring machines classify under machines/parts not elsewhere specified.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Verify refurbishment documentation and machine history to confirm 'used or rebuilt' status and avoid new machine classification
• Obtain certification from manufacturer on numerical control features and metal removal capabilities for Customs compliance
• Inspect for semiconductor-specific adaptations like vibration damping to qualify under statistical notes; declare accurately to prevent misclassification
Related Products under HTS 8459.41.00.10
Refurbished Makino S56 Vertical Boring Mill
High-speed numerically controlled vertical boring machine rebuilt for precision polishing of semiconductor wafers through controlled metal removal. HTS 8459.41.0010 designation matches its rebuilt boring functionality in wafer prep statistical notes.
Refurbished DMG Mori NTY3000 5-Axis Boring Machine
Used 5-axis numerically controlled boring-milling center rebuilt for semiconductor wafer lapping and polishing via metal removal processes. Meets HTS 8459.41.0010 criteria as rebuilt equipment for precision boring in line with statistical note wafer preparation tools.
Rebuilt Giddings & Lewis V-Series Boring Machine
Numerically controlled horizontal boring mill refurbished for metal removal in crystal boule diameter grinding for semiconductor wafers. HTS 8459.41.0010 specifically covers such rebuilt boring tools.
Refurbished Correa Fox-40 Traveling Column Borer
Large-scale numerically controlled rebuilt boring machine for precision metal removal in semiconductor wafer surface preparation. Aligns with HTS 8459.41.0010 statistical notes for grinders/lappers/polishers.
Rebuilt Mazak Quick Turn Nexus Boring Mill
A numerically controlled horizontal boring and milling machine rebuilt for high-precision metal removal in semiconductor boule grinding applications. HTS 8459.41.0010 applies to its used/rebuilt status and specific boring functions aligning with crystal grinders in statistical notes.
Used Okuma MB-500U Horizontal Machining Center
Rebuilt numerically controlled horizontal machine for boring and milling operations on semiconductor crystal boules, grinding to precise diameters. HTS 8459.41.0010 covers its used status and boring machine functionality per statistical notes.