Used or rebuilt
Machine tools (including way-type unit head machines) for drilling, boring, milling, threading or tapping by removing metal, other than lathes (including turning centers) of heading 8458: > Other boring machines: > Numerically controlled > Used or rebuilt
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8459.41.00.10
Refurbished Makino S56 Vertical Boring Mill
High-speed numerically controlled vertical boring machine rebuilt for precision polishing of semiconductor wafers through controlled metal removal. HTS 8459.41.0010 designation matches its rebuilt boring functionality in wafer prep statistical notes.
Used Haas VF-2 Vertical Machining Center
A rebuilt numerically controlled vertical machining center with 3-axis milling capabilities, refurbished for precision boring and milling operations by removing metal. Classified under HTS 8459.41.0010 as it is used/rebuilt equipment specifically for boring-milling functions in metalworking. Falls within the statistical notes for semiconductor wafer processing equipment like grinders and polishers due to its application in wafer preparation.
Refurbished DMG Mori NTY3000 5-Axis Boring Machine
Used 5-axis numerically controlled boring-milling center rebuilt for semiconductor wafer lapping and polishing via metal removal processes. Meets HTS 8459.41.0010 criteria as rebuilt equipment for precision boring in line with statistical note wafer preparation tools.
Rebuilt Giddings & Lewis V-Series Boring Machine
Numerically controlled horizontal boring mill refurbished for metal removal in crystal boule diameter grinding for semiconductor wafers. HTS 8459.41.0010 specifically covers such rebuilt boring tools.
Refurbished Correa Fox-40 Traveling Column Borer
Large-scale numerically controlled rebuilt boring machine for precision metal removal in semiconductor wafer surface preparation. Aligns with HTS 8459.41.0010 statistical notes for grinders/lappers/polishers.
Rebuilt Mazak Quick Turn Nexus Boring Mill
A numerically controlled horizontal boring and milling machine rebuilt for high-precision metal removal in semiconductor boule grinding applications. HTS 8459.41.0010 applies to its used/rebuilt status and specific boring functions aligning with crystal grinders in statistical notes.
Used Okuma MB-500U Horizontal Machining Center
Rebuilt numerically controlled horizontal machine for boring and milling operations on semiconductor crystal boules, grinding to precise diameters. HTS 8459.41.0010 covers its used status and boring machine functionality per statistical notes.
Reconditioned Doosan Puma Boring and Tapping Center
Numerically controlled rebuilt machine tool combining boring, milling, and tapping for metal removal in wafer slicing preparation equipment. Classified in HTS 8459.41.0010 as used/rebuilt boring machine with semiconductor grinding applications.
Used Hermle C52 5-Axis Milling and Boring Center
Rebuilt 5-axis CNC contouring machine for boring operations on monocrystalline semiconductor boules, enabling flat grinding for conductivity indication. Falls under HTS 8459.41.0010 as numerically controlled used boring machinery.