Reconditioned Doosan Puma Boring and Tapping Center from Germany
Numerically controlled rebuilt machine tool combining boring, milling, and tapping for metal removal in wafer slicing preparation equipment. Classified in HTS 8459.41.0010 as used/rebuilt boring machine with semiconductor grinding applications.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Ensure tapping function documentation emphasizes metal removal to distinguish from threading machines in 8458
• Use ISF filing 24+ hours prior for heavy machinery to avoid delays at semiconductor fab import sites