Reconditioned Doosan Puma Boring and Tapping Center from Germany
Numerically controlled rebuilt machine tool combining boring, milling, and tapping for metal removal in wafer slicing preparation equipment. Classified in HTS 8459.41.0010 as used/rebuilt boring machine with semiconductor grinding applications.
Duty Rate — Germany → United States
14.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Ensure tapping function documentation emphasizes metal removal to distinguish from threading machines in 8458
• Use ISF filing 24+ hours prior for heavy machinery to avoid delays at semiconductor fab import sites