Laser PCB Drilling Machine
A precision laser machine designed to drill microvias and blind vias in printed circuit boards (PCBs) by removing material through photon beam ablation. It is used solely for PCB manufacturing to create high-density interconnects essential for modern electronics. Classified under HTS 8456.12.70.00 due to its principal use in producing printed circuits.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If marketed for general material cutting beyond PCBs
General laser cutting machines for other materials fall under heading 8462 for miscellaneous machine tools, not specific to printed circuit production.
If primarily for testing or inspection rather than material removal
Laser-based testing apparatus for semiconductor devices is classified in Chapter 90 for optical instruments.
If imported as a complete semiconductor fabrication machine set
Machines for semiconductor manufacturing assembled as sets are under 8486.40 for semiconductor production equipment.
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Import Tips & Compliance
• Verify machine specifications confirm exclusive use for PCB or ADP parts to avoid reclassification; provide end-user certificates from buyers in electronics manufacturing; ensure laser safety certifications comply with FDA and OSHA standards
Related Products under HTS 8456.12.70.00
UV Laser PCB Depaneling System
A UV photon beam system that precisely cuts individual PCBs from production panels by ablating material along scored lines without mechanical stress. Principally used in high-volume printed circuit assembly lines for electronics like smartphones. Falls under HTS 8456.12.70.00 for its dedicated role in printed circuit manufacturing.
Photon Beam PCB Via Ablation Tool
Advanced tool using non-laser photon beams to ablate precise vias in multi-layer PCB substrates for high-speed data processing components. Exclusively for manufacturing parts of automatic data processing machines. HTS 8456.12.70.00 applies due to its specific use in printed circuit production.
Excimer Laser Printed Circuit Etcher
Excimer laser etcher employing ultraviolet photon beams to selectively remove copper layers from PCB laminates during circuit patterning. Used principally for fabricating printed circuit assemblies in server hardware. Classified in HTS 8456.12.70.00 for photon beam material removal in PCB production.
Laser Micro-Machining Station for PCAs
Compact station for laser micro-machining features like cavities and trenches in printed circuit assemblies (PCAs) using other light beams for 5G modules. Solely for high-precision electronics parts under heading 8517. HTS 8456.12.70.00 due to dedicated PCB/PCA application.
Femtosecond Laser PCB Structuring Equipment
Femtosecond photon beam equipment for ultra-precise structuring of PCB surfaces, creating nanostructures for advanced data processing parts. Principally used in semiconductor-adjacent PCB fabrication. Fits HTS 8456.12.70.00 for light beam material removal in printed circuits.
Photon Ablation System for ADP Parts
Industrial system using plasma-enhanced photon beams to ablate material from substrates for automatic data processing (ADP) machine parts like motherboard cores. Exclusively for printed circuit production. HTS 8456.12.70.00 specifies its use for ADP and PCB manufacturing.