Laser PCB Drilling Machine from Japan
A precision laser machine designed to drill microvias and blind vias in printed circuit boards (PCBs) by removing material through photon beam ablation. It is used solely for PCB manufacturing to create high-density interconnects essential for modern electronics. Classified under HTS 8456.12.70.00 due to its principal use in producing printed circuits.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify machine specifications confirm exclusive use for PCB or ADP parts to avoid reclassification; provide end-user certificates from buyers in electronics manufacturing; ensure laser safety certifications comply with FDA and OSHA standards